Surface-mount technology (SMT) components are used with solder reflow processes to fully automate the assembly. While through-hole technology (THT) components offer a board-mounted solution, they are typically not designed for the rigors of a reflow process. In these cases, a second soldering step is necessary. This additional step is time-consuming and allows additional margin for error.

The solution is through-hole reflow (THR) components that combine the features of PCB THT mounting with a component capable of withstanding the high thermal stress of a reflow oven.

SCHURTER is known for its compact high-performance fuse holders, and the OGN series open fuse holder for 5×20 mm fuses is no exception. In addition to existing THT and SMT versions, the series now offers a version that is compatible with THR solder processes.