Bourns, Inc. has opened a new research, development, and design center for its custom magnetics operations in Rosdorf, in the Göttingen district of Lower Saxony, Germany. The facility brings together…
Waldom is pleased to announce the appointment of Mark Shiring to the Waldom Advisory Board, further strengthening the company’s commitment to strategic leadership and industry collaboration. Shiring brings more than…
NoMIS Power Corporation, a leader in advanced Silicon Carbide (SiC) power semiconductor technology, today announced a major high-voltage milestone: the successful demonstration of its first 6.5 kV large-die SiC MOSFET.…
Sfera Labs has begun shipping Iono Pi v3, a compact DIN-rail industrial PLC that supports the Raspberry Pi 5. For engineers who need the Pi 5’s higher processing performance in…
Weidmuller USA, a leading provider of smart industrial connectivity and automation products and solutions headquartered in Richmond, Va., announces the release of significant findings from a national survey of 400…
Apex Microtechnology today announced the release of three new precision power operational amplifiers—the PA167, PA168, and PA169—expanding its Precision IC portfolio with additional high-performance amplifier options in the company’s compact…
Nordic Semiconductor (OSE: NOD), a global leader in low-power wireless connectivity solutions, today announced a faster path to satellite and cellular IoT. Embedded modem innovator LooUQ’s MTC2-N9151 has earned Skylo…
Hirose has launched a hybrid FPC-to-board connector with a fully shielded design that blocks both radiation and incident magnetic fields for clear and reliable signal transmission. The compact BK35 series…
Keystone Electronics, an industry leader in electronic components and circuit protection, broadens its selection of PCB Fuse Holders to include a new SMT Mountable Fuse Holder that specifically allows standard…
Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless connectivity, today announced the BG2B, its next Series 2 Bluetooth® Low Energy (LE) wireless SoC designed to help developers build…