Heat sink design and selection p08 | The next frontier for wearable audio is to incorporate AI p14 | Bluetooth low energy for IoT connectivity p18 | Automotive software must be roadworthy, too p22

Swapping pedal power for wireless power p08 | A compact, easy-to-implement FPGA development option p14 | Enabling chip design verification with hardware-assisted verification p24 | How can autonomous vehicles and robots know exactly where they are? p28

The pros and cons of common enclosure materials p08 | Ceramic thermal bridges p14 | Multicore processors in safety-critical applications p16 | A new direction with Gowin's low-density FPGAs p20

The benefits of FSC for RTOSes p19 | Engineering challenges in modern aerospace applications p24 | When is low cost the right choice for Bluetooth p28 | Evolutions in SWaP-C optimized connectors p31

SPE--Over the chasm and into the tornado p08 | Emerging EV architectures p12 | Introducing the Strato Pi Max p18 | Foundry services and ASIC p22

RGB Chip LEDs enhance automotive applications p10 | Electromagnetic interference: Causes and solutions p22 | Emulating the behavior of legacy storage devices p26 | MOSA lessons from FACE p29

Aluminum electrolytic capacitors in DC-to-DC converters p10 | High performance digitisers in semiconductor manufacturing p20 | Bridge mode configuration considerations p26 | FPGA Resets : The forest for the trees p30

From architecture to schematic in 60 seconds p16 | The tried-and-true operational amplifier (op-amp): An overview p22 | Advantages of PLZT capacitors in high-demand applications p24 | Bridging the AI gap with bionic vision p26

If you can't see it, you can't debug it! p08 | Solving FPGA design challenges p12 | Meet the industry's most powerful Arm MCUs p28 | How GDDR informs the future of AI inferencing p32

Reforming embedded systems p07 | Chiplets and the early adopter's dilemma p12 | Reducing the barrier to ASICs with chiplets p16 | New wearables applications are waiting in the wings p24