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May/June 2026

May/June 2026

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  • Nordic Semiconductor proves Bluetooth High Data Throughput feature in silicon
  • Hirose Develops Narrow-Width Hybrid FPC-to-Board Connector For Space-constrained Applications
  • OKW’s Ergonomic SMART-CASE Handheld Enclosures With IP 65 Protection
  • TDK introduces programmable and scalable DC-DC power supplies for emerging DC-grid architectures
  • Rohde & Schwarz introduces MXO AI Connect for AI-assisted oscilloscope workflows
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