Linxon and Siemens today announced a strategic alliance agreement designed to strengthen the delivery of medium-voltage electrical infrastructure across the rapidly growing data center, renewable energy, utility, and industrial markets.…
NEXCOM today announced the NViS 6712, a 2U NVR hardware platform designed for system integrators building high-capacity video recording, monitoring, and AI analytics systems. The platform combines 12 hot-swappable HDD…
A single device for tags, trackers, and smart home sensors, with Bluetooth LE, Thread, and Zigbee support, advanced security features, and enhanced energy efficiency. Oslo, Norway, September 15, 2026 –…
Over the last few decades, the architecture of embedded programming and debug interfaces has remained fairly consistent. A USB-connected programmer/debugger communicates with a target PCB through a ribbon or instrumentation…
TDK Corporation (TSE:6762) has expanded its B43645, B43657, B43658, B43659, B43660, and B43661 series of ultra-compact snap-in aluminum electrolytic capacitors to meet the specific needs of advanced AI server power…
Efficient Power Conversion (EPC), a leader in enhancement-mode gallium nitride (eGaN®) power devices, today announced the publication of two new technical white papers addressing critical power-conversion challenges in two rapidly…
TDK Corporation (TSE:6762) launches the TDK-Lambda TPF12500-385 series of non-isolated three-phase power supplies delivering up to 13.1 kW, with a nominal rating of 12.5 kW. With a regulated output voltage…
CENTENNIAL, Colo.–Arrow Electronics has announced global access is now available for customers to remotely evaluate NXP® Semiconductors’ Ara240 discrete neural processing unit (DNPU) via their Digital Test Drive capability. This…
In military and aerospace systems, thin-film patterned substrates serve as the foundation of some of the most critical electronic assemblies, including RF, microwave, millimeter-wave, and high-speed digital circuits. These substrates…
The sensors, processors, communications systems, and electronic capabilities available today will almost certainly be replaced, expanded, or upgraded during a platform’s service life. Yet many programs still make electrical architecture…