Infineon Technologies AG has combined its automotive expertise with its patented glass-silicon-glass MEMS sensor for the automotive tire pressure monitoring system (TPMS) market to launch the XENSIV SP49 tire pressure monitoring sensor.
The XENSIV SP49 integrates MEMS sensors with an ASIC and provides smart tire features that enable advanced tire pressure monitoring systems. It features a powerful 32-bit Arm M0+ core, a large flash memory and RAM, Low Power Monitoring (LPM), and optimized fast acceleration sensing. The SP49 is ideally suited for intelligent tire functions such as on-tire auto-position sensing, tire inflation assistance, tire blowout detection, and load detection.