TDK launches the industry’s smallest thin-film power inductors
TDK Corporation (TSE:6762) announces the introduction of its new PLE856C Series (0.80 x 0.45 x 0.65 mm; L x W x T) of compact thin-film power inductors for wearable devices.…
New Click board from MIKROE helps develop and train ML models for vibration analysis
Featuring NXP’s 3-axis low-g accelerometer, ML Vibro Sens Click helps identify machine health. ML Vibro Sens Click from MIKROE, the embedded solutions company that dramatically cuts development time by providing…
STMicroelectronics introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm
WiFi6/Bluetooth 5.3/Thread ST67W611M1 modules accelerate development and boosts flexibility to deliver advanced consumer and industrial IoT solutions. STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of…
Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger
New Solution Offers Superior Efficiency and Safety Features for Power Tools, Portable Vacuums, Lawn Mowers, Two-Wheelers, and More. Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today…
Melexis Makes a Splash with New Triphibian™ Pressure Sensor Featuring LIN Interface
Melexis introduces the MLX90833, a new pressure sensor with Triphibian™ technology, enabling robust measurement of both gas and liquid media from 2 to 70 bar, all within a compact SO16…
OKW’s TOPTEC Universal Enclosures: Perfect for PCBs with Protruding Connectors
OKW reports strong interest in its TOPTEC universal plastic enclosures following the electronica 2024 trade fair in Munich. TOPTEC allows PCBs with protruding connectors and interfaces to be mounted directly…
STMicroelectronics announces availability of STM32WL33 low-power, long-range wireless microcontrollers and dedicated ecosystem extensions
Developers have access to device-specific software and middleware as well as NUCLEO boards within the extensive STM32 ecosystem. STMicroelectronics has announced general availability of STM32WL33 wireless microcontrollers (MCUs), integrating its…
Sondrel now shipping chips as part of a complete turnkey project
Sondrel has announced that it is now shipping finished chips to a US customer as part of a full turnkey contract of concept to silicon. The chips are accelerators for…
CCPAK1212 package pushes the performance of Nexperia’s power MOSFETs to the next level
Delivering lowest RDS(on) with highest current and thermal management capability. Nexperia today announced the launch of 16 new 80 V and 100 V power MOSFETs in the innovative copper-clip CCPAK1212…
Silicon Labs’ Breakthrough Ultra-Low Power Wi-Fi 6 and Bluetooth LE 5.4 Modules Supercharge Device Deployment
New SiWx917Y Modules Offer Plug-and-Play Simplicity with Global RF Certifications. Today Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, announced the SiWx917Y…