Renesas has launched new a virtual development environment for fast automotive application software development enabling customers to bring software to market quickly. Renesas Electronics Corporation, a premier supplier of…
The new, space-saving FS series board-to-board connectors from Phoenix Contact with a pitch of 0.635 mm enable mezzanine PCB arrangements with high-speed data transmission rates up to 20 Gbps. Various numbers…
At embedded world (June 21 – 23, Nuremberg / Germany) Apacer will showcase its latest industrial storage solutions. Apacer will showcase its latest industrial storage solutions for demanding applications in…
Review Display Systems (RDS) has introduced a new USB monitor and control interface board featuring a range of I/O ports which can be controlled and monitored using a single USB…
The new BittWare program will reduce time-to-market for FPGA-based solutions. BittWare, a Molex company, a leading supplier of enterprise-class accelerators for edge and cloud-computing applications, today introduced a new partner…
Kyocera Corporation has developed a Transmissive Metasurface technology that can redirect wireless network signals in a specific direction to improve the coverage area and performance of 5G and eventually 6G…
X-FAB Silicon Foundries has expanded the scope of its SubstrateXtractor tool, via which unwanted substrate coupling effects can be examined. It is the first foundry worldwide to offer this analysis…
12.7 mm Device Featuring SSI Output Combines > 11-Bit Accuracy and 14-Bit Resolution With Increased Reliability and Durability Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new miniature position sensor…
Teledyne LeCroy’s new 1GHz probes, 12-bit high definition oscilloscopes provide ultimate accuracy for wide-bandgap semiconductor testing. Teledyne LeCroy today announced the launch of their new DL-ISO High Voltage Optically Isolated…