QSiC™ 1200 V COPACK Power Modules with isolated backplate is tested at over 1400 V and targets solar inverters, energy storage and server power supplies. SemiQ Inc, a designer, developer,…
Auto Makers, OEMs and ADAS System Developers can now quickly & affordably add Thermal 2D & 3D Imaging to their ADAS Sensor Suites. Critical for pedestrian safety, Owl’s 3D Thermal…
Advanced Thermal Solutions now provides heat sinks for component sizes ranging from 27 to 70mm square. This wider size range accommodates semiconductor components, including FPGAs, ASICS and other package types,…
MINI Series Uncooled Therma Camera has an ultra-small size of 21mm by 21mm and ultra-low power consumption. It can meet the application of the requirements scenarios demanding high integration and…
The only simulator in the industry to enable web-based electrically and thermally coupled analysis. ROHM Semiconductor has announced the addition of a new thermal analysis function to the ROHM Solution…