Diodes Incorporated (Diodes) (Nasdaq: DIOD) expands its AH371xQ series of automotive-compliant* Hall effect latches for motor control applications that need to operate at very low magnetic thresholds and bipolar switching…
Melexis announces the MLX81119, an 18-channel LIN RGB LED controller with an integrated DC/DC converter, designed to simplify and optimize automotive lighting systems. By generating the LED supply voltage locally…
TDK Corporation announces advancements in sensor technology that optimize and accelerate the deployment of smart IoT solutions, SensorGPTTM. This technology uses generative AI, signal processing, statistical methods, and simulations to…
As satellite communications and defense systems expand, RF testing is becoming ever more critical and complex. Rohde & Schwarz will host the second edition of its virtual RF Testing Innovations…
Diodes Incorporated (Diodes) (Nasdaq: DIOD) introduces the PI3EQX32904Q, an automotive-compliant*, 32Gbps, four-channel linear ReDriver that optimizes signal integrity for high-speed protocols such as PCI Express® (PCIe®) 5.0 specification, SAS4, and…
The TCS43 is a microminiature SMT tactile switch designed for high-performance applications requiring compact size, reliability, and precise haptic feedback. With a footprint of just 4.2 × 3.2 mm and…
Vishay Intertechnology, Inc. today announced that its VETH100A1DD1 ESD protection diode, offered in the DFN1006 package, has successfully passed IEEE 10BASE-T1S compliance testing, confirming its suitability for use in automotive…
OKW has launched COMMUNITEC, an elegant new range of desktop/portable enclosures for large-format electronics. These smart modern enclosures are ideal for medical equipment, laboratory instrumentation, test and measurement, automation, fault…
SiTime Corporation, the Precision Timing company, today announced the Elite 2 Super-TCXO® to increase GPU utilization and compute efficiency in AI data centers by delivering better time synchronization. The product…
Vishay Intertechnology, today announced its new thin film submount platform, designed to support next-generation optical transceivers, RF modules, and advanced electronic packaging applications requiring high thermal performance, precision alignment, and…