Anyone building connected edge products knows how challenging packaging components and ensuring everything works as intended can be. A Wi-Fi front-end, Bluetooth Low Energy (BLE) coexistence, and 802.15.4 radio if…
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new web-based RF engineering tool — the Antenna…
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is exhibiting at IMS 2026, also known as the IEEE…
Menlo Microsystems Inc. (Menlo Micro), a leader in high-performance switching solutions, today announced the industry’s first broadband RF switching platform that covers DC to 70 GHz, which extends switching performance…
As satellite communications and defense systems expand, RF testing is becoming ever more critical and complex. Rohde & Schwarz will host the second edition of its virtual RF Testing Innovations…
Vishay Intertechnology, today announced its new thin film submount platform, designed to support next-generation optical transceivers, RF modules, and advanced electronic packaging applications requiring high thermal performance, precision alignment, and…
Richardson Electronics, Ltd. (NASDAQ: RELL), an industry-leading global provider of engineered solutions and RF and Microwave technologies, will be showcasing its latest technology partners at the 2024 IEEE MTT-S International…
SV Microwave, a leading designer and manufacturer of high-performance RF and microwave connectors, cable assemblies, and components, will exhibit at the IEEE MTT-S International Microwave Symposium (IMS) 2025, taking place…
Keep up with faster development cycles by using smarter debugging tools. The level of complexity of embedded devices continues to increase unabated. In my previous column (https://bit.ly/43ENb2W), we considered the…