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Design Latest Products Power Design Sensors

Iono Pi v3 Now Shipping: High Performance versatile I/O module

Sfera Labs has begun shipping Iono Pi v3, a compact DIN-rail industrial PLC that supports the Raspberry Pi 5. For engineers who need the Pi 5’s higher processing performance in…

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Weidmuller USA Releases New National PCB Design Survey: Engineers Share Insights on PCB Design Tools + AI Tool Impacts & Gaps

Weidmuller USA, a leading provider of smart industrial connectivity and automation products and solutions headquartered in Richmond, Va., announces the release of significant findings from a national survey of 400…

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Apex Microtechnology Expands Power Operational Amplifier Family with Three New Compact High-Performance Devices

Apex Microtechnology today announced the release of three new precision power operational amplifiers—the PA167, PA168, and PA169—expanding its Precision IC portfolio with additional high-performance amplifier options in the company’s compact…

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Nordic’s nRF9151 opens satellite and cellular IoT to a new class of connected devices

Nordic Semiconductor (OSE: NOD), a global leader in low-power wireless connectivity solutions, today announced a faster path to satellite and cellular IoT. Embedded modem innovator LooUQ’s MTC2-N9151 has earned Skylo…

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Hirose Launches Hybrid FPC-to-Board Connector with Fully Shielded Structure for Superior EMI Prevention

Hirose has launched a hybrid FPC-to-board connector with a fully shielded design that blocks both radiation and incident magnetic fields for clear and reliable signal transmission. The compact BK35 series…

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Surface Mountable 5mm Glass Fuse Holders

Keystone Electronics, an industry leader in electronic components and circuit protection, broadens its selection of PCB Fuse Holders to include a new SMT Mountable Fuse Holder that specifically allows standard…

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Silicon Labs Unveils BG2B, Its Lowest-Power Bluetooth LE SoC with Industry-Leading Power Efficiency, Security, and Integration

Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless connectivity, today announced the BG2B, its next Series 2 Bluetooth® Low Energy (LE) wireless SoC designed to help developers build…

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4763 IEC Appliance Combi-Outlet Type F/J for Smart PDUs

With the new 4763 Type F/J outlet, SCHURTER offers a flexible solution for modern power distribution systems, particularly in data centers. By combining Type F and Type J in a…

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TDK adds vibration-resistant axial and soldering-star capacitors for 125 V and upgrades 63 V series

TDK Corporation (TSE: 6762) has expanded its axial/soldering star-aluminum electrolytic capacitor lineup with 125 V-rated components to the B43693/B43793 series (125 V to 250 V) and upgraded the 63-V series…

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Molex Introduces MiniMix Hybrid Power and Signal Connectors to Accelerate Humanoid Robotics Mass-Production Scaling

Molex, a global electronics leader and connectivity innovator, today unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid…

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  • Nordic Semiconductor proves Bluetooth High Data Throughput feature in silicon
  • Hirose Develops Narrow-Width Hybrid FPC-to-Board Connector For Space-constrained Applications
  • OKW’s Ergonomic SMART-CASE Handheld Enclosures With IP 65 Protection
  • TDK introduces programmable and scalable DC-DC power supplies for emerging DC-grid architectures
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