Skip to content
  • Latest News
  • Newest Products
    • Analog Design
    • Assembly
    • Automotive Electronics
    • Connectors & Cabling
    • Defense
    • Design
    • Digital Design
    • Displays
    • Distribution
    • EDA
    • Embedded Software
    • Enclosures
    • Frequency
    • IoT
    • LED Lighting
    • Medical Electronics
    • Memory
    • Microprocessors
    • Mobile Technology
    • New Products
    • Opto Electronics
    • Passives
    • Power Design
    • Printed Electronics
    • Programmable Platforms
    • Robotics
    • Semiconductors
    • Sensors
    • Smart Transport
    • Test & Measurement
    • Thermal Managment
    • Wearable Technology
  • Designer’s Corner
  • Contact
  • Subscribe to Receive DENA
  • Latest Issues
  • About
  • Advertise
Design Latest Products

Hirose Announces Commercial Availability of its Compact, 1000V Wire-to-Board Connector for Automotive Powertrains

Hirose has announced the commercial availability of its high-voltage ZE150HV Series wire-to-board connector. Ideal for electric vehicle (EV) and hybrid electric vehicle (HEV) powertrains, the connector features a 4.5 mm…

Connectors & Cabling Design Latest Products

TDK announces expansion of TDK SensEI edge intelligence portfolio with launch of edgeRX Pro sensor module

TDK Corporation today announced the launch of the TDK SensEI edgeRX Pro, a new high-performance sensor node that expands its predictive maintenance platform, edgeRX. edgeRX Pro integrates vibration, acoustic, magnetic,…

Design Latest Products

Avnet Silica Releases Latest Trendliner Report Examining Semiconductor Outlook and Supply Pressures

Avnet Silica, an Avnet company, today released the latest edition of its quarterly Trendliner market report. Providing an overview of global and European semiconductor market conditions, the latest report includes…

Enclosures Latest Products

New Prototyping Test Enclosures Simplify Speaker Design

Same Sky and its Audio Group today announced the introduction of speaker prototyping test enclosures. Initially supporting 15 x 11 mm, 16 x 9 mm, and 18 x 13 mm…

Analog Design Latest Products Sensors

TDK introduces programmable DIN-rail mount isolated DC-DC converters with 120 W and 240 W outputs and wide conversion ratios

TDK Corporation announces the introduction of the TDK-Lambda DDSM 120 W and 240 W programmable DC-DC converters. These products feature a wide input and output voltage range with an isolated…

Design Latest Products

Microchip Advances Space-Grade Timing with Enhanced Radiation Tolerance and Extended Temperature Performance

The growing New Space market is fueling demand for smaller, less expensive space hardware to support short-duration missions for applications such as satellite-to-cellular communications, alternative navigation and Earth imaging. Microchip…

Latest Products Power Design Sensors

Breaking Down MLCC Surprises

Modern electronics depend heavily on MLCCs. A single EV like the Tesla Model 3 contains roughly 10,000 MLCCs compared to about 500 to 3,000 capacitors in a traditional internal combustion…

Latest Products

Kinetic Technologies Introduces KTS1642Q Automotive Load Switches Designed to Simplify Compliance with ISO 16750-2 and ISO 7637-2 Power Transient Standards

Kinetic Technologies, a Cyient Semiconductors company and a leader in high-performance analog and mixed-signal semiconductor solutions, today announced the KTS1642Q. This AEC-Q100 qualified automotive load switch is specifically designed to…

Automotive Electronics Design Latest News Power Design

Bourns Opens Custom Magnetics Research and Development Center in Göttingen, Germany

Bourns, Inc. has opened a new research, development, and design center for its custom magnetics operations in Rosdorf, in the Göttingen district of Lower Saxony, Germany. The facility brings together…

Design Enclosures Latest Products Power Design Sensors

NoMIS Power Demonstrates 6.5 kV SiC MOSFET, Advancing a High-Voltage Roadmap to 10 kV and 20 kV SiC IGBTs

NoMIS Power Corporation, a leader in advanced Silicon Carbide (SiC) power semiconductor technology, today announced a major high-voltage milestone: the successful demonstration of its first 6.5 kV large-die SiC MOSFET.…

Posts pagination

1 … 5 6 7 … 113
Latest Issue

Recent Posts

  • Mouser’s Newest Issue of Methods Technology and Solutions Journal Explores the Future of Food Sustainability
  • Nordic Semiconductor proves Bluetooth High Data Throughput feature in silicon
  • Hirose Develops Narrow-Width Hybrid FPC-to-Board Connector For Space-constrained Applications
  • OKW’s Ergonomic SMART-CASE Handheld Enclosures With IP 65 Protection
  • TDK introduces programmable and scalable DC-DC power supplies for emerging DC-grid architectures
Follow Us

LinkedIn

Twitter

Proudly powered by WordPress | Theme: News Way by Themeansar.

  • About
  • Advertise
  • Contact
  • Latest Issues
  • Privacy and cookies policy
  • Subscribe to Receive DENA