Smartphone makers are looking to piezo-based micropump platforms to keep phones cool. In contrast to vapor chambers—the rigid passive cooling method that dominates the marketplace today—piezo-based micropumps are active solutions that use aliquid cooling film to keep the phone cool.
Piezo-based micropumps are particularly needed for the 54.3M folding phones that IDC expects to come to market by 2027. This is because brittle vapor chambers fracture where the phone bends, which folding phones do, all the time.
Boréas Technologies has announced its piezoelectric (piezo) driver IC, the CapDrive BOS1921, which can activate the piezo micropump-based cooling system in a mobile device using 10x less power than competitive piezo drivers. This extreme power efficiency is a dramatic improvement over other piezo drivers, which often generate more heat than they can eliminate in a micropump-based active cooling solution.