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Assembly Latest Products

OGN series fuse holder is now THR compatible

Surface-mount technology (SMT) components are used with solder reflow processes to fully automate the assembly. While through-hole technology (THT) components offer a board-mounted solution, they are typically not designed for…

Latest Products Power Design

UHP – High Current SMD Fuse for Primary Protection of Battery Systems

SCHURTER officially announces the launch of its newest addition to the SCHURTER Fuse portfolio: The fast-acting UHP High Current SMD Fuse, designed to safely interrupt high-energy overcurrent in battery systems.…

Latest Products Power Design

Dazed and confused about switches?

Switches are ubiquitous, so why do so few of us use the correct terminology? Even though their underlying technologies are more than 100 years old, electromechanical switches continue to permeate…

Latest News Latest Products

Advanced plastic enclosures for medical devices

OKW’s BODY-CASE for wearable personal medical devices, alarm call, location detection, and dose metering. The first thing clinicians and patients see and touch in the case of a medical device…

Latest Products Power Design

Considerations when designing for power

System designers often have to choose between standard, custom, and modular power supplies. When designing a system that requires some form of power conversion, the power source (power supply or…

Latest News Latest Products

Portenta X8: The two-in-one module combining Arduino and Linux

The X8’s hybrid combination of microprocessor and microcontroller offers developers unprecedented flexibility. The company that fired up the maker movement has strategically grown into a full-fledged industrial partner over the…

Latest Products Power Design

3-Phase EMC Filter Series Designed for Machine Safety

SCHURTER expands the FMAC NEO and FMAD NEO 3-phase filter families to meet IEC 60204-1. Downsized for smaller footprint, without any compromise to performance, the two new filter series are…

Design Latest Products

Heterogeneous compute heralds a new era in chip verification

It is no longer sufficient to simulate analog and digital blocks separately in a “divide and conquer” approach. We are at a time when the computing performance benefits of Moore’s…

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Modern thermal analysis overcomes complex electronic design issues

Thermal gradient of a cellphone using the Celsius Thermal Solver (Source: Cadence) By combining finite element analysis with computational fluid dynamics, designers can perform complete system analysis using a single…

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SMT heat pipes for thermal management

These novel SMT solutions pre-empt thermal issues in a unique way Thermal management has always been an important part of design but is gaining prominence with the development of wide-band-gap…

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  • Nordic Semiconductor proves Bluetooth High Data Throughput feature in silicon
  • Hirose Develops Narrow-Width Hybrid FPC-to-Board Connector For Space-constrained Applications
  • OKW’s Ergonomic SMART-CASE Handheld Enclosures With IP 65 Protection
  • TDK introduces programmable and scalable DC-DC power supplies for emerging DC-grid architectures
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