Solving FPGA design challenges
by Reg Zatrepalek, Director of FPGA and SoC Workshop Solutions, 2RTP Inc. Want to QuickStart your AMD SoC FPGA design? As FPGAs continue to evolve, designs are becoming increasingly complex.…
If you can’t see it, you can’t debug it!
Bill Lamie, President and CEO at PX5 RTOS PX5 RTOS is now tightly integrated with Percepio’s Tracealyzer. Debugging in the dark is a tough task! We’ve all been there—hours before…
Advanced over-temp detection for EV Li-ion battery packs
Littelfuse is excited to introduce TTape, a groundbreaking overtemperature detection platform designed to transform the management of Li-ion battery systems. With its innovative features and unparalleled benefits, TTape helps vehicle…
Dual-core Bluetooth low energy SoC with integrated flash
The newly introduced DA14592 Bluetooth Low Energy (BLE) System-on-Chip (SoC) represents Renesas’s lowest power consumption and smallest multi-core (Cortex-M33, Cortex-M0+) BLE device. By carefully balancing tradeoffs between on-chip memory (RAM/ROM/Flash)…
Squeezing ultimate performance into a tiny 3D magnetometer
Melexis has announced the MLX90394 Triaxis micropower magnetometer. This tiny Hall-effect based sensor perfectly balances design trade-offs between low noise, current consumption, and cost. With on-the-fly selectable modes and advanced…
OKW’s Tough IP 65 HAND-TERMINAL Enclosures For Industrial Instruments And Machine Controllers
Ergonomic HAND-TERMINAL plastic enclosures are designed specifically for heavy-duty handheld electronic devices. They offer plenty of space for operating elements, displays, pushbuttons and large switches, and feature a recessed area…
Advanced in-cabin sensing to enhance vehicle safety and comfort
At CES 2024, Eyeris Technologies, OMNIVISION, and Leopard Imaging demonstrated a reference design to improve safety and comfort in the entire automobile cabin. This jointly developed reference design integrates Eyeris’…
A new dimension of acceleration
Bosch has launched the world’s smallest (1.2 × 0.8 × 0.55mm3) MEMS accelerometers for wearables and hearables. Space is at a premium in hearables, smartwatches, and other portable consumer products,…
BODY-CASE wearable plastic enclosures for the IoT/IIoT
Growth in the IIoT mobile electronics segment is set to further boost demand for OKW’s BODY-CASE (IP 65) wearable plastic enclosures. The ergonomic BODY-CASE enclosures are ideal for IoT/IIoT, automation,…
Back flip FPC/FFC connector offers dual contact functionality
Hirose has expanded its back flip FPC/ FFC connector offerings to include a 0.5mm-pitch version that offers dual contact functionality to simplify flex routing. The space-saving TF07V Series has a…